Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300 °C
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چکیده
منابع مشابه
INTERACTIONS OF Cu-SUBSTRATES WITH TITANIUM-ALLOYED Sn-Zn SOLDERS
The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the s...
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A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of...
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Cyclic-tension fatigue of aluminum alloy, Al-4Cu-1Mg, was determined by an analysis of diffracted SH and SV waves, passing through the surface and reflecting the bottom of the specimen, respectively. The internal friction of SV waves begins to increase from fatigue damage ratio(=N/Nf) of 0.5. This suggests increase of movable dislocation. From the analysis of SH waves, the logarithmic damping r...
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ژورنال
عنوان ژورنال: Ultrasonics Sonochemistry
سال: 2018
ISSN: 1350-4177
DOI: 10.1016/j.ultsonch.2017.08.020